Variosystems develops and manufactures electronic solutions for industries where reliability is critical - including Medtech & Life Science, Industrial & Automation, Aerospace & Defence and Smart Infrastructure & Environment. As a long-term strategic partner to innovators and market leaders, we offer services along the entire value chain, from concept and engineering to validated assemblies and global production. Across our global network, more than 2,800 people work together to transform ideas into reliable electronic systems. 

外壳与结构设计

• 负责电子产品外壳的机械架构及 3D/2D 结构设计，平衡美学、人体工程学和成本。 
• 与硬件工程师紧密合作，定义 PCB 外形轮廓（Outline）、元器件高度、接口/连接器布局及禁布区（Keep-out zones），确保无缝装配。 
• 根据产品需求，选择合适的材料（如塑料、金属、硅胶）和制造工艺（如注塑成型、CNC 加工、钣金、3D 打印）。 
• 进行公差尺寸链分析（Tolerance stack-up analysis）和结构干涉检查，确保所有机械部件的可靠性、配合度及表面精细度。 

原型制作与可制造性设计（DFM） 

• 制作并评估物理原型机（利用 3D 打印或 CNC）；针对面向制造的设计（DFM）和面向装配的设计（DFA）进行设计优化。 

模具与工装跟进

• 与模具供应商共同评审模具图纸，跟进试模流程（T1、T2...），并解决结构缺陷（如缩水、熔接线、变形等）。 

测试与验证

• 参与机械可靠性测试（如跌落测试、振动测试、冷热循环、防水/防尘测试等），并对任何失效模式进行根本原因分析（RCA）。 

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Enclosure Design

• Responsible for the mechanical architecture and 3D/2D structural design of electronic product enclosures, balancing aesthetics, ergonomics, and cost. 
• Work closely with the Hardware Engineer to define PCB outlines, component heights, connector placements, and keep-out zones to ensure seamless assembly. 
• Select appropriate materials (e.g., plastics, metals, silicone) and manufacturing processes (e.g., injection molding, CNC machining, sheet metal, 3D printing) based on product requirements. 
• Conduct tolerance stack-up analysis and structural interference checks to ensure the reliability, fit, and finish of all mechanical parts.  

Prototyping & DFM

• Build and evaluate physical prototypes (using 3D printing or CNC); optimize designs for Design for Manufacturing (DFM) and Design for Assembly (DFA).  

Mold & Tooling Follow-up

• Review mold drawings with tooling suppliers, follow up on mold trials (T1, T2...), and resolve mechanical defects (such as shrinkage, weld lines, or deformation).  

Testing & Verification

• Participate in mechanical reliability testing (e.g., drop tests, vibration, thermal cycles, waterproof/dustproof testing) and drive root-cause analysis for any failures. 

教育背景

• 机械工程、机电一体化、模具设计、产品设计或相关专业本科及以上学历。 

工作经验

• 3-5 年电子产品（消费电子、工业模块或手持设备）结构设计经验。 

硬实力/技术技能

• 熟练掌握至少一种主流 3D 建模软件（优先考虑 Creo/ProE、SolidWorks 或 UG/NX），并熟练使用 AutoCAD 绘制 2D 工程图。 
• 深入理解塑料注塑成型原理、模具结构、钣金制造以及表面处理工艺（如喷涂、阳极氧化、丝网印刷）。 
• 熟悉散热设计方法（散热片、导热垫）以及利用硅胶圈（Gasket）或超声波焊接进行的侵入防护（IP54/IP67 防水防尘）设计。 

优先条件

• 拥有完整的产品生命周期管理经验，涵盖从最初的概念草图到量产交付（NPI 新产品导入流程）。 
• 具备有限元分析（FEA）的基础知识，可进行结构强度或热仿真模拟。 

软实力 

• 对尺寸、公差和外观细节极度严谨。 
• 具备卓越的沟通能力，能够完美衔接工业设计（ID）的美学要求、硬件（MD）的结构限制以及工厂的制造极限。 

语言能力 

• 具备良好的中文（普通话）口语及书面表达能力。 
• 具备良好的英语口语及书面表达能力。 

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Education

• Bachelor’s degree or above in Mechanical Engineering, Mechatronics, Mold Design, Product Design, or related fields.  

Experience

• 3-5 years of experience in structural design for electronic products (consumer electronics, industrial modules, or handheld devices). 

Technical Hard Skills

• Proficient in at least one mainstream 3D modeling software (e.g., preferred Creo/ProE, SolidWorks, or UG/NX) and AutoCAD for 2D engineering drawings. 
• Deep understanding of plastic injection molding principles, mold structures, sheet metal fabrication, and surface treatment processes (e.g., painting, anodizing, silk-screening). 
• Familiar with thermal dissipation methods (heatsinks, thermal pads) and ingress protection (IP54/IP67 waterproofing) design using gaskets or ultrasonic welding.  

Preferred Qualifications

• Experience handling complete product lifecycles from initial concept sketch to mass production (NPI process). 

• Basic knowledge of Finite Element Analysis (FEA) for structural strength or thermal simulations. 

Soft Skills 

• Highly meticulous regarding dimensions, tolerances, and cosmetic details. 
• Excellent communication skills to bridge the gap between industrial design (ID) aesthetics, hardware (MD) constraints, and factory manufacturing limitations.  

Language Skills 

• Mandarin in spoken and written 
• English in spoken and written