Job Description

• Lead cross-functional teams across Design, Systems, Validation, Product/Test Engineering, Firmware, Supply Chain, Procurement, and Quality to ensure seamless program execution in NPI projects.
• Lead COGS reduction programs from impact assessment through qualification, PCN, safelaunch, and production ramp – quantifying savings, evaluating ROI, and assessing the business impact of schedule slips and risk scenarios.
• Drive capacity expansion initiatives across global manufacturing sites, aligning engineering, operations, and supply chain to support production scalability.
• Build and manage detailed schedules for NPI, COGS and capacity programs; track progress, remove roadblocks, and implement data‑driven mitigation plans.
• Manage Engineering Build Request prioritization, conducting bi‑weekly reviews with PMO and Business Operations leadership to ensure alignment with organizational priorities.
• Act as a liaison between the product group, operations/supply chain teams, and key OSAT interface teams to ensure alignment, clarity, and seamless execution across all stages of the program.
• Drive sample readiness and ramp readiness, ensuring cross‑functional teams maintain schedules that support committed customer delivery timelines.
• Coordinate and conduct Project Gate reviews, ensuring cross‑functional readiness, milestone alignment, and clear communication of risks and dependencies.
• Oversee wafer fab, assembly, and test operations to ensure timeline adherence, cost efficiency, and quality standards across programs.
• Provide structured leadership updates on program status, risks, and mitigation plans, maintaining accurate schedules and qualification documentation.

• Bachelor’s or Master’s degree in Electrical Engineering, with 8+ years of experience in semiconductor packaging technology and product lifecycle management.
• Strong understanding of semiconductor packaging manufacturing flows – including development and production processes, package architectures, and various package types with prior work experience at an assembly site as a process or integration engineer considered a strong plus.
• Proven ability to lead complex, cross‑functional programs in ambiguous environments, supported by foundational Program/Project Management knowledge (coursework, certification, or equivalent).
• Strong stakeholder management, communication, collaboration, and cross‑functional partnership skills across engineering, operations, supply chain, and OSAT teams.
• Highly analytical with strong organizational, problem‑solving, time‑management, and multitasking capabilities.
• Quick learner with the ability to adopt new tools, systems, and processes efficiently; proficient in Microsoft Office and project management tools.
• Self‑motivated, inquisitive, and committed to continuous personal and professional development.

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.