Arista Networks is an industry leader in data-driven, client-to-cloud networking for large data center, campus and routing environments. What sets us apart is our relentless pursuit of innovation. We leverage the latest advancements in cloud computing, artificial intelligence, and software-defined networking to provide our clients with a competitive edge in an increasingly interconnected world. Our solutions are designed to not only meet the current demands of the digital landscape but to also anticipate and adapt to future challenges.

At Arista we value the diversity of thought and perspectives that each employee brings to the table. We believe that fostering an inclusive environment, where individuals from various backgrounds and experiences feel welcome, is essential for driving creativity and innovation.

Our commitment to excellence has earned us several prestigious awards, such as Best Engineering Team, Best Company for Diversity, Compensation, and Work-Life Balance. At Arista, we take pride in our track record of success and strive to maintain the highest standards of quality and performance in everything we do.

Who You’ll Work With

Working closely with cross-functional teams including Hardware Design, Signal Integrity (SI), Power Integrity (PI), Mechanical Engineering, Thermal Engineering, and Manufacturing, our engineers innovate on system architectures and ultra-high-speed PCB designs to deliver state-of- the-art networking platforms.

What You'll Do

Our Hardware Design Engineering team is at the forefront of developing high-speed networking and Ethernet products used in enterprise campuses, hyperscale datacenters, and next-generation AI clusters. The team is responsible for end-to-end design and development of advanced hardware solutions that meet the demands of modern networking environments — including optical interface platforms up to 800G and 1.6T.

Core Responsibilities

 High-Speed Layout & Routing

• Implement complex routing for advanced interfaces such as 112G/224G SerDes, PCIe Gen 5/6, DDR4/5/6
• Design and route high-speed differential pairs with tight skew and impedance control
• Execute dense BGA fan-out for high-pin-count ASICs and FPGAs

Optical Transceiver PCB Layout (800G / 1.6T)

• Design and layout boards supporting high-bandwidth optical transceivers (QSFP-DD, OSFP, OSFP-XD or equivalent)
• Route 112G / 224G PAM4 electrical channels between switch ASICs and optical modules
• Define insertion loss budgets and coordinate with SI engineers to meet IEEE compliance requirements
• Optimize breakout routing beneath high-density optical cages
• Implement via stub mitigation strategies including backdrilling for ultra-high-speed signal paths
• Manage ground reference continuity, EMI control, and return path integrity near optical connectors
• Consider thermal dissipation (20W–30W+ modules) in layout planning

Impedance Control & Signal Integrity

• Design advanced multi-layer stack-ups (20–30+ layers)
• Calculate impedance profiles and ensure low-reflection, low-crosstalk performance
• Collaborate with SI teams on channel modeling and pre-/post-layout simulations

Power Integrity (PI) Optimization

• Design robust Power Distribution Networks (PDNs) for high-current ASICs
• Layout multi-phase DC/DC converters for high transient loads
• Strategically place decoupling capacitors to ensure wideband impedance stability

Thermal & Mechanical Coordination

• Integrate thermal vias, heat sink attachments, and high-conductivity materials
• Coordinate mechanical constraints such as enclosure, airflow, and structural limitations
• Ensure proper placement and structural integration of optical cages

Advanced Fabrication Deliverables

• Generate comprehensive manufacturing packages (Gerber, ODB++, IPC-2581)
• Define backdrilling parameters and impedance specifications
• Ensure compliance with DFM, DFA, and DFT requirements
• Support boards through fabrication, assembly, and production ramp

Library & Feasibility Ownership

• Create and maintain high-density component footprints (e.g., large BGAs, optical module connectors)
• Participate in new product feasibility studies
• Develop detailed routing guidelines and work packages for layout partners
• Review external placement and routing work to ensure quality and schedule adherence

• Bachelor’s or Master’s degree in Electrical Engineering, Electronics, or related field
• 10+ years of relevant hardware engineering experience
• Proven experience designing networking hardware, particularly involving 100G/200G PAM4 Ethernet switching
• Direct experience in high-speed optical transceiver PCB layout (800G and/or 1.6T preferred)
• Expertise with 112G / 224G PAM4 routing and channel optimization
• Advanced proficiency in Cadence Allegro and Sigrity
• Experience designing 20+ layer boards with 50G+ signals
• Hands-on experience with sequential lamination, HDI, ultra-low-loss materials
• Experience in multi-phase DC/DC layout for high-current, high transient loads
• Strong manufacturing knowledge including DFM, DFA, and DFT for 30+ layer rigid and rigid-flex boards
• Demonstrated success taking products from concept through mass production

Arista stands out as an engineering-centric company. Our leadership, including founders and engineering managers, are all engineers who understand sound software engineering principles and the importance of doing things right.
We hire globally into our diverse team. At Arista, engineers have complete ownership of their projects. Our management structure is flat and streamlined, and software engineering is led by those who understand it best. We prioritize the development and utilization of test automation tools.
Our engineers have access to every part of the company, providing opportunities to work across various domains. Arista is headquartered in Santa Clara, California, with development offices in Australia, Canada, India, Ireland, and the US. We consider all our R&D centers equal in stature.
Join us to shape the future of networking and be part of a culture that values invention, quality, respect, and fun.