Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

ESSENTIAL DUTIES AND RESPONSIBILITIES 

In this position, you will work in the Material Engineering team within the Packaging R&D organization who owns and deploys best-in-class material engineering solutions to the top-edge product and technology development across advanced semiconductor packaging, flash memory product and host levels. Your essential duties and responsibilities include:

• Drive advancement in packaging materials by addressing material-related design and process challenges. Develop solutions to support next-generation package requirements, including smaller form factors, thinner die, higher interconnect density, increased power, and enhanced reliability.
• Lead the evaluation, development, and qualification of advanced packaging materials for both product development and high-volume manufacturing. Ensure compliance with industry standards and sustain high material quality to enable reliable, high-yield, and cost-efficient manufacturing.
• Responsible for material characterization, lab testing, and design of experiments (DOE) to simulate manufacturing processes and use-condition failure. Analyze thermal, mechanical, and environmental performance to ensure materials meet reliability and performance targets.
• This position will interface with package and product design (in particular, thermal and mechanical), reliability, failure analysis, assembly R&D, and process teams to define material requirements and solutions. Collaborate with suppliers to develop, optimize, and qualify materials for successful production integration.

REQUIRED

• Master’s, or PhD in Materials Science or related engineering field.
• Minimum 5 years of experience in semiconductor packaging, materials engineering, or related industries.
• Solid knowledge through academic coursework or experience required in Materials Science and Engineering or related areas.
• Strong background in material characterization and/or material mechanics with emphasis on failure analysis and design of experiment.
• Strong understanding of packaging materials system (e.g., polymers, adhesives, laminates, EMC, substrates).
• Familiarity with industry standards and reliability test methods (ASTM, JEDEC).
• Experience working in cross-functional working environments.

PREFERRED

• Working knowledge in various material testing and characterization instruments.
• Good understanding of general semiconductor packaging processes, materials, technology and trends, such as molding, wire-bonding, die attach, flip chip, SMT, etc.
• Experience in supplier engagement and sustainability-driven material development is an advantage.

SKILLS

• Strong oral and written communication skills.
• Strong analytical, problem-solving, and critical thinking skills to address complex challenges.
• Demonstrated strong work ethic.
• Ability to work in a global team environment and interact with other engineers to define and implement experiments and provide material solutions to support advanced packaging technology development.

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email [email protected].