Renesas is a global semiconductor company providing hardware and software solutions for a range of cutting-edge technologies including self-driving cars, robots, automated factory equipment, and smart home applications. We are a key supplier to the world’s leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you.

Renesas is a global, multi-billion dollar, publicly traded company headquartered in Japan, and has subsidiaries in 20 countries worldwide. Renesas is a dynamic, multi-cultural technology company where employees learn, mentor, innovate and thrive. Renesas is extending our share in fast-growing data economy-related markets such as infrastructure and data center and strengthening our presence in the industrial/IOT and automotive segments. Our solutions drive products developed by major innovators around the world. Join us and build your future by being part of what’s next in electronics.

Job Description

We are looking for a Package design Engineer to join our advanced silicon packaging design and simulation team and contribute to the design and delivery of high‑performance 2.5D/3D, chiplet‑based, FCBGA, SiP, wire bond and QFP/QFN packages used in industry‑leading products. The role requires strong technical depth in package layout execution, manufacturability, and cross‑domain co‑design with silicon, SI/PI, thermal, and reliability teams.

Key Responsibilities

• Perform package layout design and development for advanced packages including 2.5D/3D IC, FCBGA, SiP, and multi‑chip modules.
• Develop and maintain package CAD databases, ensuring accuracy and adherence to design guidelines, Design for Manufacturing (DFM), and Design for Assembly (DFA) requirements to ensure producibility.
• Manage end-to-end design cycle, including schematic creation, netlist import, footprint assignment, and generation of manufacturing outputs (Gerbers, drill data, fabrication/assembly drawings).
• Create and modify substrate/RDL layouts, bump maps, escape routing, and power/ground structures.
• Work closely with SI/PI, thermal, reliability, and DFT teams to support co‑design and optimization and participate in design reviews.
• Ensure designs comply with foundry, OSAT, and manufacturing design rules (DRC, LVS).
• Support ECO cycles, design updates, and version control throughout the project lifecycle.

Minimum Qualifications

• 6+ years of hands‑on experience in Package CAD layout and development.
• Strong experience with 2.5D / 3D IC packaging, FCBGA and advanced substrate‑based packages, Multi‑die and chiplet‑based designs.
• Proficiency in industry‑standard tools such as: Cadence Allegro Package Designer (APD / SiP), Siemens Xpedition / Innovator, or equivalent.
• Experience working with advanced manufacturing design rules and OSAT interfaces.
• Good understanding of Signal Integrity (SI) and Power Integrity (PI) fundamentals, and High‑Speed Design concepts.
• Strong communication, presentation, and documentation skills with the ability to work effectively in a team environment.

Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
 
With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’     
 
At Renesas, you can: 

• Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.  

• Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. 

• Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.    

Are you ready to own your success and make your mark?  

Join Renesas. Let’s Shape the Future together.  

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.