Role: ASIC Package Engineer SI/PI Engineer

Location: Remote

Interview: Phone/Skype

Job Type: Contract

Job Description: Experienced ASIC Packaging Engineer focusing on Signal Integrity and Power Integrity to support the development of custom ASICs.

Responsibilities:

• Drive chip-package-system co-design by driving signal and power integrity requirements analysis and optimization.

• Define power tree structure and netlists for High Performance Computing based on 2.5D/3D package technology.

• Run pre-layout and post-layout simulation flow for high-speed interface and PDN.

• Develop SIPI validation methodology and detailed engineering test plans.

• Validate high-speed interface and PDN impedance in lab.

• Collaborate with Architecture, ASIC, Mixed Signal, Package, and PCB Design teams.

• Perform package/board power delivery network AC+DC simulation.

• Develop next-gen memory interface considering IO PHY, SI/PI, and physical design.

Skills: #SIPI #ASICPackaging #HighSpeedInterface #PowerTree #Simulation #Validation #Electromagnetics #MIPI #PCIe #CadenceSigrity #PowerSI #AnsysSIwave #KeysightADS #3DLayout #AnsysHFSS

🔹 Eligibility Criteria:

• ✔️ Genuine H1B candidates with verifiable I-94 travel history (C2C acceptable).

• ✔️ Green Card & US Citizens will be considered only on W2 payment terms.

🚀 If you or someone you know is a strong match, let's connect immediately!

All your information will be kept confidential according to EEO guidelines.