The future. It’s on you. You & Western Digital.

We’ve been storing the world’s data for more than 50 years. Once, it was the most important thing we could do for data. Now we’re helping the world capture, preserve, access and transform data in a way only we can.

The most game-changing companies, consumers, professionals, and governments come to us for the technologies and solutions they need to capture, preserve, access, and transform their data.

But we can’t do it alone. Today’s exceptional data challenges require your exceptional skills. It’s You & Us. Together, we’re the next big thing in data. 
 
Western Digital® data-centric solutions are found under the G-Technology™, HGST, SanDisk®, Tegile™, Upthere™, and WD® brands.

Experience Level: 14+ years   

Skill Set (Mandatory to have) : Teradyne J750 or relevant ATE experience , Test Program Development

Preferred Skill : DFT knowledge

.       Architect ATE Test Solution for Memory Controller and work as Technical Lead/Mentor for multiple projects

·       Develop Test program in Wafer/Package for a controller ASIC on Teradyne J750 Platform.

·       Take ownership to fix issues in Test Program across Projects and provide solutions to address gaps across DFx functions to deliver high quality test program

·       Interfaces with Product, Design, Hardware, DFT, Production and Reliability engineering to solve problems.

·       Create Test Requirement for Hardware and DFx

·       Validate and review ASIC test Patterns and Test Program to improve quality

·       Verify using Bench Instruments, R&R for Test Program, correlation, release and Factory Support

·      Drive collaboration with PE / Design / DFT / Verification / Characterization / SI team

·     Ensure High Yield, High Quality and Low Test Time

·       The ideal individual must have proven ability to achieve results in a fast moving, dynamic environment. Self-motivated and self-directed, however, must have demonstrated ability to work well with people. A proven desire to work as a team member, both on the same team and outside of the team.

·       Ability to troubleshoot and analyze complex problems.

·       Ability to multi-task and meet deadlines.

·       Excellent communication (written and verbal) and interpersonal skills.

Experience Level: 14+ years      

.     B.E/B.Tech/ME/MS/M.Tech is required   

Experience with Probe card and device interface boards design for ASIC.

·       Experience developing Production / Characterization Test Program for controllers from scratch.

·       In-depth knowledge and Hands on working experience on Teradyne J750 platform.

·       Experience in PCB design with SI / PI guidelines for high speed testing.

·       Experience with Probers and Handlers.

·       Experience in test data analysis and closely work with Product, Design, DFT, Production and Reliability engineering teams.

·       Experience in DFT, Analog, E-Fuse and mixed signal test.

·       Experienced in test time reduction, yield enhancement and HW design for manufacturing.

·       Experienced in working with bench instruments like DMM, Oscilloscope etc for debug.

·       Knowledge of OOP based programming, PERL scripting and data analysis tools like Spotfire.

·       Knowledge of HTOL, Assembly is a plus.

·       Knowledge of Semiconductor device physics

·       Knowledge of Semiconductor manufacturing process and automotive standard practices is a plus.

All your information will be kept confidential according to EEO guidelines.