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• Job Summary:

  As a Staff/Principal Engineer in the Equipment Development Department for Flash Drive Manufacturing, you'll be instrumental in navigating equipment development. This includes evaluating, selecting, and optimizing manufacturing processes and equipment. Your role involves making crucial decisions on equipment procurement, utilizing Design of Experiments (DOE) for studying new materials and processes. Effective communication with stakeholders is essential for successful project outcomes. This position demands expertise in the flash back end, spanning from wafer fab to back-end processes.

  Key Responsibilities:

• Equipment Evaluation and Procurement:

• Conduct studies on new equipment and processes in response to the introduction of innovative products.
• Collaborate with cross-functional teams to define equipment requirements, specifications, and timelines for product manufacturing.
• Provide hands-on leadership in packaging and silicon-related FA analysis for rapid risk identification and improvement areas for both new NPI products and HVM products.
• Assess assembly risks during Fab new processes or design changes in mass production.
• Design of Experiments (DOE):
• Systematically apply DOE methodologies to study and optimize new materials and manufacturing processes for flash drive components, covering SMT line, wafer fab, wafer front end, and wafer back end.
• Collaborate with R&D and process engineering teams to design and execute experiments aimed at enhancing product quality, yield, and efficiency.
• Provide strong technical leadership, driving fundamental-based packaging technology development, and leading investigations on complex technology issues involving both fab and assembly packaging teams.
• Communication and Collaboration:
• Engage with internal teams, including R&D, manufacturing, and quality assurance, to comprehend project requirements and constraints for flash drive manufacturing.
• Effectively communicate with equipment vendors, negotiating terms, specifications, and ensuring seamless integration of new equipment into the manufacturing process for both flash drives and wafers.
• Collaborate with technicians and operators, providing training and support during equipment implementation and operation.
• Project Management:
• Manage projects related to equipment development, ensuring adherence to timelines, budgets, and quality standards for flash drive manufacturing.
• Regularly provide project updates to key stakeholders, addressing challenges, and proposing solutions to maintain project progress.

• Bachelor's or Master's degree in Mechanical Engineering, Electrical Engineering, or a related field.
• 5+ years of experience in equipment and/or process development for flash drive manufacturing, covering SMT line, wafer fab, wafer front end, and wafer back-end processes.
• Strong knowledge of flash drive manufacturing processes and materials, with expertise in machines related to SMT line, wafer front end, and wafer back end.
• Understanding of NAND/ASIC operation principles, Experience in Chip Package Interaction (CPI), packaging materials, process, thermal, and package design.
• Proficiency in applying Design of Experiments (DOE) for process optimization.
• Experience in wafer fabrication processes such as lithography, etching, deposition, PVD will be an added advantage.
• Excellent communication and interpersonal skills to collaborate effectively with diverse teams.
• Project management experience is a plus.
• Ability to make informed decisions regarding equipment selection and procurement.

All your information will be kept confidential according to EEO guidelines.

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