Senior Engineer, Packaging Engineering

  • Full-time
  • Business Function: Packaging Engineering
  • Work Location: Taichung Office--LOC_SNDK_Taichung SNDK Office

Company Description

The future. It’s on you. You & Western Digital.


We’ve been storing the world’s data for more than 50 years. Once, it was the most important thing we could do for data. Now we’re helping the world capture, preserve, access and transform data in a way only we can.

The most game-changing companies, consumers, professionals, and governments come to us for the technologies and solutions they need to capture, preserve, access, and transform their data.

But we can’t do it alone. Today’s exceptional data challenges require your exceptional skills. It’s You & Us. Together, we’re the next big thing in data. 
 
Western Digital® data-centric solutions are found under the G-Technology™, HGST, SanDisk®, Tegile™, Upthere™, and WD® brands.

Job Description

 1. Substrate layout and design.

 2. Design PKG outline drawing/strip drawing.

 3. Design bonding diagram

 4. Communication with assembly house and substrate vendors

Qualifications

1.   Major subject is science and engineering

2.   Must have electronics and mechanics concept.

3.   Familiar with Autodesk 2000 version up.

4.   Fluent English communication skill

Additional Information

NCG type

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