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Chemical Mechanical Planarization (CMP) Process Development is part of the Wafer Wet Process Development, the Principal Engineer will be responsible to develop new CMP process and technology, enable and accelerate technology deployment into head products to meet HDD requirements through product life cycle.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Partner with wafer wet process development engineers and technicians responsible for CMP new process development, methodology setup, consumables, and advance tooling delivery to meet new product launch requirement, schedule, and manufacturability.
• Work with cross functional teams including design, integration, and other development process modules on designs incorporating CMP or resolving any integration issue.
• Lead on trouble-shoot the related issues in development line, conduct defect analyses, root cause analyses, and implement corrective and preventive actions.
• Responsible for new process to manufacturing engineering (ME) transferring, support ME team on necessary process implementing and manufacturing ramping.
• Apply quantitative analysis and novel machine learning technology for wafer wet process module data analysis. Build statistically solutions to provide feedback guidance to improve process development performance.

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REQUIRED:

• MS, or PhD degree in physics, chemistry, chemical engineering, materials science, or a related engineering field.
• Understanding microelectronics wafer fabrication process including CMP, photolithography, dry or wet etching, electroplating, or thin film deposition processes.

PREFERRED:

• Strong background on machine learning of process data analysis for performance improvement. Experience with statistical analysis tools is a plus.
• Experience in wafer-level magnetic recording head fabrication and integration are desirable.

SKILLS:

• Excellent communication skills, both written and oral. Able to work on the resolution of any issue and to interact with various interdepartmental team and support organizations.

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