LAUNCH Staff Engineer, Packaging Engineering
- Milpitas, CA
- Business Function: Packaging Engineering
- Work Location: Milpitas Office--LOC_WDT_USCA25
At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.
At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that. Our technology helped people put a man on the moon.
We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.
Binge-watch any shows, use social media or shop online lately? You’ll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That’s us, too.
We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital®, G-Technology™, SanDisk® and WD® brands.
Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.
•Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified, and introduced into production in a timely manner while meeting all mechanical, electrical, performance, reliability and quality requirements.
•Working with cross-functional teams, factories, and other engineers, manages the entire package life cycle process.
•Coordinates with factories and contract manufacturers worldwide on the high volume introduction of new packages and assembly processes.
•Works with the Packaging R&D teams worldwide to develop and qualify new and emerging packaging technology required to support business needs
•Manages assembly yield improvement and package cost reduction programs
•Responsible for maintaining package roadmaps and budgets for the product lines supported.
Ph. D. in ME, Materials, Electronic, Physics engineering
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