At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.

At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that. Our technology helped people put a man on the moon.

We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.

Binge-watch any shows, use social media or shop online lately? You’ll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That’s us, too.

We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital®, G-Technology™, SanDisk® and WD® brands.

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

Act substrate design role in package design department.

·       Optimize die bonding pad, flip chip die plot and substrate layouts for possible design simplification and cost reduction of Multi-Chip stack die packages and stand alone ASIC packages.

·       Explore routing and placement changes that could lower the substrate complexity and cost.

·       Provide substrate layout feasibility and documentation for laminate package designs.

·       Perform Design Library maintenance and bonding diagram generation.

·       Interface seamlessly with product managers, substrate designers, manufacturing and assembly engineering and layout groups at the assembly subcontractors.

·       Work closely with various manufacturing and packaging groups at various WDC locations for new product development and substrate design improvement.

·       Work with assembly houses and substrate venders on design review and design rule maintenance.

·       Bachelor or Master in Science or Engineering.

·       Familiar with substrate design rule, fabrication and assembly rule.

·       Familiar with software Cadence SIP and AutoCAD.

·       Experience on BD generation and SIP design.

·       Good communication and interpersonal skill is necessary.

·       Contact trainers below for training courses if needed

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.