Join a multibillion-dollar global company that brings together amazing technology, people, and operational scale to become a powerhouse in the memory industry. Headquartered in Rancho Cordova, California, Solidigm combines elements of an established, successful technology company with the spirit, agility, and entrepreneurial mindset of a start-up. In addition to the U.S. headquarters and other facilities in the U.S., the company has international presence in Asia, Europe, and the Americas. Solidigm will continue to lead the world in innovating new Memory technologies with aspirations to be the #1 NAND memory company in the world. At Solidigm, we view problems as opportunities to define innovative solutions that hold the power to change the world and unleash the potential technological needs that the future holds. At Solidigm, we are One Team that fosters a diverse, equitable, and inclusive culture that embraces individual uniqueness and empowers us to bring our best selves to deliver excellence in support of Solidigm's vision and mission to be the go-to partner for optimized data storage solutions. You can be part of the takeoff of an innovative business that develops cutting-edge products, delivers strong business value for customers, provides an engaging workplace for its employees, and serves a greater impact on the world. This is a golden opportunity for the right applicant to join us and help design, build, and lead Solidigm. We want a diverse team of dedicated professionals who will not just be Solidigm team members but contribute to how we shape the future of the organization. We are seeking applicants who will grow and thrive in our culture; be customer inspired, trusting, innovative, team-oriented, inclusive, results driven, collaborative, passionate, and flexible.

• Detailed responsibility includes but not limit to:
• Early engagement with NPI process development teams to influence DFM (design for manufacturing), DFA (design for assembly), and proliferate a newly developed HVM recipe
• Collaborate with NPI engineering in developing new SSD rework techniques and maintain them in HVM. Co-ownership of manufacturing recipe characterization with NPI teams, define CTF (Critical-to-Function) process parameters, monitor NPI execution as well as qualifying rework procedures • Based on capacity demand, take ownership for new site or new production line start-up/certification, process & equipment qualification, engineering whitepaper review, and approval.
• Continuous improvement in production yield, quality and process/module stability, drive cost reduction through lean projects. Ownership of HVM standard and process change control, chair/drive process change control board (PCCB), ensure sufficient engineering data review and qualification coverage to support the change request approval. 
• Ownership of manufacturing excursion management, chair/drive material review board (MRB), based on technical risk assessment (TRA) and failure analysis (FA) data, pull-in right engineering supporting teams to quickly nail down the root cause, drive risk mitigation plan, corrective action plan, as well as systematical fixes for the issues.

• Must possess a bachelor’s or master’s degree in science, or mechanical, material or electrical/electronic engineering discipline
• A minimum of 5 years of experience in the Boards/Modules manufacturing engineering. Strong knowledge on SMT, module assembly, rework, material sourcing, selection and qualification, failure analysis related to assembly processes, excursion management.
• Proven track record of efficiently utilizing 5-whys root cause analysis, PFMEA, DOE, SPC, trouble shooting and excursion control, structural problem solving.
• Strong communication and stakeholder influence skills.
• Possess strong desire to work in system manufacturing assembly and help drive continuous manufacturing process improvement through LEAN, Six Sigma, World Class Manufacturing, and other continuous improvement techniques are desired.

Other critical soft skills required are:

• Knowledge of program management. Good communications and presentation skills in English.
• Command of Chinese both verbal and written is a must

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