Join a multibillion-dollar global company that brings together amazing technology, people, and operational scale to become a powerhouse in the memory industry. Headquartered in Rancho Cordova, California, Solidigm combines elements of an established, successful technology company with the spirit, agility, and entrepreneurial mindset of a start-up. In addition to the U.S. headquarters and other facilities in the U.S., the company has international presence in Asia, Europe, and the Americas. Solidigm will continue to lead the world in innovating new Memory technologies with aspirations to be the #1 NAND memory company in the world. At Solidigm, we view problems as opportunities to define innovative solutions that hold the power to change the world and unleash the potential technological needs that the future holds. At Solidigm, we are One Team that fosters a diverse, equitable, and inclusive culture that embraces individual uniqueness and empowers us to bring our best selves to deliver excellence in support of Solidigm's vision and mission to be the go-to partner for optimized data storage solutions. You can be part of the takeoff of an innovative business that develops cutting-edge products, delivers strong business value for customers, provides an engaging workplace for its employees, and serves a greater impact on the world. This is a golden opportunity for the right applicant to join us and help design, build, and lead Solidigm. We want a diverse team of dedicated professionals who will not just be Solidigm team members but contribute to how we shape the future of the organization. We are seeking applicants who will grow and thrive in our culture; be customer inspired, trusting, innovative, team-oriented, inclusive, results driven, collaborative, passionate, and flexible. 

Solidigm is seeking an innovative Package Developer to support pathfinding and development of package technologies for Solid State Drive (SSD) and NAND flash storage card applications. In this position, you will be responsible for innovation in packaging technologies to meet the SSD product roadmap. In addition, you will be responsible for the development of package design, including package stack-up and configuration, substrate design, design collaterals, package pin assignments, signal integrity simulation and assessment, package data sheets, and interface with internal/external standards forums. Other responsibilities include driving/tracking package design milestones, integrating product requirements into packaging solutions, identifying and resolving packaging design issues, and communicating design status.

• Perform die fit analysis, stack-up, reference plane, and power distribution for multi-die NAND packages.
• Define device package pin-out and I/O bus interface.
• Integrate design requirements from high-speed electrical signaling, high-volume assembly design rules, package and/or PCB design rules, automated test, and emerging IC packaging techniques.
• Perform package and/or PCB routing study analysis for tradeoffs in cost and performance.
• Perform design, analysis, and validation of off-silicon platform interconnects, with a focus on memory interfaces such as DDR2 or on high-speed differential I/O interfaces such as SATA or PCIe.
• Define and develop electrical modeling capabilities and analysis techniques for busses and interconnects.
• Work with subcontractors in advancing packaging design rules for product roadmap intercept.

• Bachelor's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, Material Science, or a related technical field.
• Experience: Minimum of 5 years of experience in package architecture, IC packaging, or PCB design engineering.
• Expertise with advanced packaging technologies, signal integrity simulation, and electrical analysis of high-speed interconnects (e.g., DDR2, SATA, PCIe, etc.).
• Proven track record of successfully developing package design processes, including stack-up configuration, substrate design, die-fit analysis, and pin-out definition.
• Hands-on experience with signal integrity simulation tools such as HFSS, Sigrity, or CST Microwave Studio.
• Familiarity with packaging technology considerations such as die fit analysis, power distribution planning, routing tradeoff studies, and signal integrity concerns.
• Strong project management and communication skills to manage cross-functional teams across both internal teams and subcontractors.
• Ability to represent Solidigm in industry standard forums, collaborate effectively across multiple divisions, and integrate standards into product development.

Preferred Qualifications:

• Master's degree or PhD in Electrical Engineering, Mechanical Engineering, or Material Science.
• Experience: Over 8 years of in-depth technical expertise in IC packaging design or NAND product development.
• Knowledge of emerging packaging technologies and techniques (e.g., wafer-level packaging, 2.5D/3D IC integration).
• Familiarity with JEDEC, ONFI, and other industry standards for memory and SSD packaging.
• Advanced proficiency in package modeling tools and techniques.
• Solid understanding of solder joint reliability failure modes and the factors influencing reliability (design, material quality, soldering techniques).
• Solid understanding of package substrate design practices from a signal integrity and power integrity perspective.
• Knowledge of electrical analysis and design of high-speed buses (differential and single ended) as well as familiarity with simulation, modeling, and analysis tools.
• Understanding of thermal analysis and optimization related to multi-die NAND packages.
• Experience driving packaging technology innovation by partnering with subcontractors and suppliers.
• Ability to coordinate across multiple business divisions and contribute to the roadmap of SSD/NAND packaging technologies.

This position offers a competitive annual salary range of TWD2,682,430 - TWD5,230,670

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