Smiths Interconnect, is a global leader in the design and manufacture of high-performance interconnect solutions. Our products are used in mission-critical applications across industries such as aerospace, defense, telecommunications, and industrial markets. At Smiths Interconnect, we are committed to innovation, quality, and providing cutting-edge solutions that connect the world’s most demanding systems. Smiths Interconnect is part of Smiths Group. For over 170 years, Smiths has been pioneering progress by engineering for a better future. We serve millions of people every year, to help create a safer, more efficient and productive, and better-connected world across four global markets: energy, security & defense, space & aerospace and general industrial. Listed on the London Stock Exchange, Smiths employs c.16,000 colleagues in over 50 countries. 

• Support, contribute and promote a safe work environment.
• Perform signal integrity simulations for engineering designs on connectors or semiconductor IC chip test sockets or probe heads
• Develops technology and processes for high-speed measurement of test sockets, connectors, PCB’s and other components.
• Designs and develops PCBs and fixtures for testing and characterization of engineering designs.
• Set up machines, equipment and design/develop process fixtures.
• Responsible for prototyping and evaluation of new products in leading edge applications.
• Interprets customer specifications and writes test procedures to qualify new and existing products.
• Recommends capital investments for leading edge technologies that will keep the company on the forefront of the industry. 
• Specify tooling and equipment needed to support the production build.
• Provide technical support to organizational stakeholders (Production, Quality, Marketing and Sales).
• Consult with Sales in quoting customer requirements and bid preparation.
• Participate and contribute to team training, development, mentoring and audits.
• Demonstrate behaviors consistent with company policies.
• Coordinates with project team to ensure milestones are achieved and risks are mitigated.
• Provides test plans, schedules and cost work sheets for qualification of new and existing products
• Suggests changes in working conditions and use of equipment, systems, tools and process to increase organizational efficiency.
• Analyzes and resolves work problems and/or assists others in solving work problems.
• Relies on extensive experience, analytical capacity, problem solving skills/tools and judgment to plan and accomplish goals.

• General educational, experience and competency requirements defined in current revision of the “Engineering Career Ladder”.
• Knowledge of RF, Digital and Power cables and connectors or related knowledge.
• Familiar using HFSS to perform simulation to generate IL, RL, TDR, and Crosstalk.
• Understanding of RF/Signal Integrity simulations on electric-mechanical structures.
• Understanding of RF/Digital test equipment, software and procedures. Be able to use VNA to perform electrical measurement.
• Ability to perform Root Cause Analysis utilizing standard problem-solving tools and methodologies.
• Knowledge of 3D modeling using drawing and simulation packages.
• Knowledge of PCB design (Plus only)