Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

We are seeking a detail-oriented and analytical Technologist, Packaging Engineering to join our team in Milpitas, United States. In this role, you will drive innovation in packaging solutions while ensuring efficiency, quality, and compliance across all product lines. You will collaborate with cross-functional teams to design, develop, and optimize packaging systems that meet customer requirements and regulatory standards. The ideal candidate will bring a systematic approach to problem-solving and a commitment to continuous improvement in packaging technology.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Serve as the senior Package Engineering representative on cross‑functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements.
• Provide end‑to‑end ownership of the package lifecycle across design, development, qualification, and manufacturing, driving alignment among cross‑functional engineering teams, global factories, and key stakeholders.
• Lead global engagement with factories and contract manufacturers to enable robust, scalable, and cost‑effective high‑volume introduction of new package designs and advanced assembly processes.
• Partner with Packaging R&D organizations worldwide to define, develop, and qualify next‑generation and emerging packaging technologies in alignment with long‑term business strategy and product roadmaps
• Drive enterprise‑level assembly yield improvement initiatives and package cost‑reduction programs, establishing best practices and measurable performance targets across supported product lines.
• Own package technology roadmaps, oversee budgets for supported products, and guide the development of scalable packaging infrastructure to support future growth and technology transitions.
• Lead new products through the transition from low‑volume to high‑volume manufacturing, ensuring yield, quality, and reliability objectives are achieved. Establish and enforce readiness of FMEA, SOD, Control Plans, process recipes, SPC, and other critical assembly controls prior to high‑volume production.
• Provide technical leadership in evaluating and validating design options through characterization builds and comprehensive DFX (Design for excellence) analyses, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), influencing product architecture and manufacturing strategy at the system level.

REQUIRED:

• Master’s degree or PhD in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics or other engineering disciplines.
• Minimum 10 years of relevant work experience with a Master's degree, or 8+ years of experience with a PhD
• Proficient understanding of packaging domains including SMT, PCBA, solder joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout
• Additional expertise in die attach, wire bonding, wafer thinning, and molding processes is a plus
• Experience with machine learning and data analytics utilizing AI technologies

SKILLS:

• Strong problem-solving skills with demonstrated expertise in experimental design and statistical analysis
• Excellent written and verbal communication skills with the ability to collaborate effectively with global cross-functional teams
• Knowledge of thermo-mechanical aspects of semiconductor packages and Solid-State Drives
• Assist in developing and maintaining the Package Technology Roadmap, working with global assembly, and packaging teams.
• Demonstrated experience mentoring or managing junior engineers is a plus
• Continuously track major industry benchmark announcements in packaging and proactively build organizational awareness of competitive and emerging benchmark strategies
• Familiarity with industry benchmarking trends and packaging technology roadmap development

Sandisk is committed to providing equal opportunities to all applicants and employees and will not discriminate against any applicant or employee based on their race, color, ancestry, religion (including religious dress and grooming standards), sex (including pregnancy, childbirth or related medical conditions, breastfeeding or related medical conditions), gender (including a person’s gender identity, gender expression, and gender-related appearance and behavior, whether or not stereotypically associated with the person’s assigned sex at birth), age, national origin, sexual orientation, medical condition, marital status (including domestic partnership status), physical disability, mental disability, medical condition, genetic information, protected medical and family care leave, Civil Air Patrol status, military and veteran status, or other legally protected characteristics. We also prohibit harassment of any individual on any of the characteristics listed above. Our non-discrimination policy applies to all aspects of employment. We comply with the laws and regulations set forth in the "Know Your Rights: Workplace Discrimination is Illegal” poster. Our pay transparency policy is available here.

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

Based on our experience, we anticipate that the application deadline will be 06/25/2026 (3 months from posting), although we reserve the right to close the application process sooner if we hire an applicant for this position before the application deadline. If we are not able to hire someone from this role before the application deadline, we will update this posting with a new anticipated application deadline.

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Compensation & Benefits Details

• An employee’s pay position within the salary range may be based on several factors including but not limited to (1) relevant education; qualifications; certifications; and experience; (2) skills, ability, knowledge of the job; (3) performance, contribution and results; (4) geographic location; (5) shift; (6) internal and external equity; and (7) business and organizational needs.
• The salary range is what we believe to be the range of possible compensation for this role at the time of this posting.  We may ultimately pay more or less than the posted range and this range is only applicable for jobs to be performed in California, Colorado, New York or remote jobs that can be performed in California, Colorado and New York.  This range may be modified in the future.
• You will be eligible to participate in Sandisk's Short-Term Incentive (STI) Plan, which provides incentive awards based on Company and individual performance.  Depending on your role and your performance, you may be eligible to participate in our annual Long-Term Incentive (LTI) program, which consists of restricted stock units (RSUs) or cash equivalents, pursuant to the terms of the LTI plan. Please note that not all roles are eligible to participate in the LTI program, and not all roles are eligible for equity under the LTI plan. RSU awards are also available to eligible new hires, subject to Sandisk's Standard Terms and Conditions for Restricted Stock Unit Awards.
• We offer a comprehensive package of benefits including paid vacation time; paid sick leave; medical/dental/vision insurance; life, accident and disability insurance; tax-advantaged flexible spending and health savings accounts; employee assistance program; other voluntary benefit programs such as supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity; tuition reimbursement; transit; the Applause Program, employee stock purchase plan, and the Sandisk's Savings 401(k) Plan.
• Note: No amount of pay is considered to be wages or compensation until such amount is earned, vested, and determinable. The amount and availability of any bonus, commission, benefits, or any other form of compensation and benefits that are allocable to a particular employee remains in the Company's sole discretion unless and until paid and may be modified at the Company’s sole discretion, consistent with the law.