The Bosch Group is a leading global supplier of technology and services. Since the beginning of 2013, its operations have been divided into four business sectors: Automotive Technology, Industrial Technology, Consumer Goods, and Energy and Building Technology.

The Bosch Group comprises Robert Bosch GmbH and its roughly 360 subsidiaries and regional companies in some 50 countries. If its sales and service partners are included, then Bosch is represented in roughly 150 countries. This worldwide development, manufacturing, and sales network is the foundation for further growth.

Bosch Global Software Technologies Company Limited (BGSV) is 100% owned subsidiary of Robert Bosch GmbH - one of the world’s leading global suppliers of technology and services, offering end-to-end Engineering, IT, and Business Solutions.

Starting its operation from 2010 at Etown 2 in HCMC, BGSV is the first software development center of Bosch in Southeast Asia. BGSV nowadays have over 4,000 associates, with a global footprint and presence in the US, Europe, and the Asia Pacific region.

With our unique ability to offer end-to-end solutions that connect sensors, software, and services, we enable businesses to move from the traditional to digital or improve businesses by introducing a digital element in their products and processes.

Job Description

Own PCB layout implementation for automotive HPC and chiplet-based platforms, translating approved schematics, electrical constraints, and mechanical requirements into manufacturable multilayer and HDI board designs. Deliver release-ready layouts that meet signal integrity, power integrity, reliability, and fabrication requirements.

Key Responsibilities:

• Own component placement, fine-pitch BGA escape routing, and detailed routing for multilayer and HDI PCBs used in automotive HPC and chiplet-based systems.
• Implement constraint-driven routing for DDR/LPDDR, PCIe, Ethernet, and SerDes, controlling impedance, length matching, differential-pair geometry, crosstalk, and return paths in collaboration with SI/PI engineers.
• Define PCB stack-ups, material requirements, via structures, and HDI build-up with hardware, SI/PI, mechanical, and fabrication teams, balancing electrical performance, reliability, and manufacturing capability.
• Implement power and ground planes, decoupling placement, and power routing to agreed current-carrying, thermal, EMI/EMC, and power integrity requirements using Cadence Allegro, Altium Designer, or equivalent ECAD tools.
• Create and verify component footprints, pad stacks, and ECAD library data; maintain layout databases and controlled design revisions throughout the release process.
• Prepare fabrication and assembly release packages, including Gerber/ODB++ data, drill files, stack-up specifications, fabrication and assembly drawings, placement data, and associated BOM documentation.
• Conduct layout reviews, design-rule checks, and DFM/DFA/DFT checks; resolve fabrication and assembly queries with suppliers and implement agreed layout corrections in line with applicable automotive requirements and processes.
• Maintain PCB layout guidelines, checklists, and release documentation; communicate layout risks, design trade-offs, and delivery status proactively to cross-functional teams.

Qualifications

• Bachelor’s degree in Electrical or Electronic Engineering, or an equivalent qualification.
• 5+ years of hands-on PCB layout experience, with demonstrated ownership of complex, high-density, high-speed boards from placement through manufacturing release.
• Strong expertise in multilayer stack-ups, HDI, fine-pitch BGA escape routing, microvias, via-in-pad, and constraint-driven routing, including knowledge of fabrication capabilities and reliability trade-offs.
• Practical experience routing DDR/LPDDR, PCIe, Ethernet, and SerDes, with a solid understanding of impedance control, timing constraints, return paths, decoupling, and SI/PI-driven layout practices.
• Proficiency in Cadence Allegro, Altium Designer, or equivalent PCB layout tools, including constraint management, footprint and pad-stack creation, library management, and revision-controlled release workflows.
• Working knowledge of PCB fabrication and assembly processes, DFM/DFA/DFT, and relevant IPC standards; experience preparing manufacturing deliverables and resolving supplier feedback. Automotive PCB experience is preferred.
• Ability to interpret schematics and mechanical constraints, explain layout trade-offs, and work independently with hardware, SI/PI, mechanical, and manufacturing teams.

Soft skills

• Result oriented
• Strong analytical and problem-solving mindset
• Structured and quality-driven working approach
• Ability to work effectively in cross-functional and global teams
• Good English communication (spoken & written)

Further details regarding compensation and benefits will be shared during the interview process.