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We as MFG-SMT-CoC（SMT Manufacturing Technology Center of Competence） industrialize processes for Assembly and Interconnect Technologies (AIT) for the production of Printed Circuit Boards (PCB) and cooperate closely with development departments and manufacturing plants.

ME/MFG-SMT-CoC2是制造工厂与研发部门的衔接窗口，一方面与全球的研发部门合作进行工艺开发，另一方面与全球的制造工厂合作进行工艺的标准化。AE/MFT1主要专注于汽车电子制造SMT领域的以上活动。

1. Co-work with global virtual selective soldering team to provide technical service to ME global 13 plants.
2. Support defining selective soldering process roadmap and yearly target.
3. Initiate and coordinate selective soldering process improvement topics and standardization topics with new ideas.
4. On-site or virtually support ME global plants to reduce internal defect cost; Third level support on unsolved complex problems from global plants.
5. Define process related standards for global plants on selective soldering process.
6. Support or lead standard machine selection for global plants.
7. Drive the alternative sourcing which is high quality and low cost for tooling and fixtures.
8. Boost and develop automation and digitalization related topics with digital engineer’s support.
9. Know-how and lesson learned delivery internally to global plants.
10. Work with suppliers on below dimensions and roll it out to all AE plants
• New function (hardware or software) development.
• Existing function optimization
• Solving machine general problems collected from global plants.
11. Support process development department on new technology related feasibility study.
12. Organize or support organizing technical activities with selective soldering experts from global plants.
13. Involve on lean related daily work improvements.
1. 与不同国家的选择焊工艺专家组成3-4人的跨国小组给全球13家工厂提供技术服务。
2. 参与制定本工艺3-5年的发展蓝图和年度目标。
3. 以创新理念设计部署实施选择焊工艺改善项目和标准化项目。
4. 支持全球13工厂的工艺不良改善及疑难杂症解决。
5. 为选择焊工艺制定全球工艺标准。
6. 为全球工厂制定设备标准，支持或者领导标准设备评估。
7. 评估性价比高的工治具。
8. 孵化自动化和数字化相关的项目并与数字工程师合作进行实施。
9. 在工厂间进行知识管理和经验教训相关的总结分享。
10.与供应商合作产出以下解决方案并导入到全球工厂：
• 新功能研发（软件或者硬件）
• 现有功能的优化
• 工厂普遍问题的追踪解决
11.与工艺研发相关人员合作进行新工艺或者新技术的评估。
12.组织或者支持全球工厂专家相关的技术活动。
13.日常lean相关的改善。

- Bachler or master’s degree with engineering background or equivalent knowledge.
- 3-5 years or above of working experience on electronic industry and direct experience on selective soldering process (e.g. multi-wave soldering; DIP soldering; mini-wave soldering).
- Understanding of MES and Manufacturing IT structure
- Be familiar with the design of tooling and fixture.
- Good English skill to communicate with contacts from different countries - Certain level of moderation skill to guarantee output of workshop and meeting
- Strong intercultural communication and presentation skills. With experience on leading intercultural team will be a plus. - Basic Project handling skill - High willingness to change and learn new things like digital transformation

1. 本科或以上学历，工程背景优先。
2. 3-5年或以上电子工业相关工作经验(SMT+FA)及选择焊设备工艺保养相关经验（multi-wave soldering, Dip soldering, mini-wave soldering）
3. 了解MES及其架构。
4. 熟悉选择焊相关的工治具设计制造评估。
5. 英语口语流利，书写能力佳。（必须）
6. 有组织工作坊或者大型会议的能力。
7. 沟通能力强，展示能力强。如果有跨文化沟通相关的经验从优。 如果有领导跨文化组织的经验从优。
8. 有较强的项目管理能力。如果有lean相关的经验从优。
9. 有领导或参与自动化或数字化相关项目的经验。有数字化相关的知识（比如Python）从优。

在博世，您将获得：

Grow -成长，定义不凡-你的成长，或许会影响世界

  大平台，大挑战，更大可能，触手可及的发展机遇，面向全球，面向未来

Enjoy -生活，定格乐活-好工作，是好生活的一部分

  全方位福“励”，倍感舒心，效率为先，更尊重你的生活

Inspire -灵感，慧启世界-个人的灵感，一群人的力量，改变一大群人的生活

  特别的你，与众不同的我们，改变世界，我们想的做的都一样

• 该岗位内部推荐奖金为人民币5,000元整（仅限博世内部员工申请），具体请参见《博世中国内部推荐政策》

• Internal Referral bonus of this vacancy: RMB 5,000 (Valid only for Bosch associates). For the detailed regulation, please refer to Bosch China Internal Referral Policy