TW_感測器研發_ASIC Packaging Development Engineer

  • 6F, No. 90, Sec. 1, Jian Guo N. Road, Taipei, Taiwan
  • Full-time
  • Legal Entity: Robert Bosch Taiwan Co., Ltd.

Company Description

Do you want beneficial technologies being shaped by your ideas? Whether in the areas of mobility solutions, consumer goods, industrial technology or energy and building technology - with us, you will have the chance to improve quality of life all across the globe. Welcome to Bosch.

博世集團於1990 年開始在台灣營運,2006年10月整合台灣地區各事業單位,成立在台事業總部,命名為台灣羅伯特博世股份有限公司。自此即開始為在地客戶提供提升其生活品質的產品與服務。由於我們持續不斷的投資及發展,目前博世在台有四個分公司以及四個研發中心。博世在台提供的產品包含汽車原廠零件、汽車售後服務零件、傳動與控制系統、安防系統、包裝技術、熱能產品、電動工具、家電產品、微機電感測器以及微機電麥克風等。


台灣博世隸屬於德國博世集團 - 全球知名的科技與服務供應大廠。我們產品及服務的設計宗旨在於提供吸引人的科技。因此,本公司透過 “科技成就生活之美”創新而有效的解決方案、產品及服務,協助改善人們的生活品質。

Job Description

Development of ASIC semiconductor packages
- Project team lead of simultaneous-engineering-teams with interfaces to customer (RB internal), production, quality, reliability, purchasing and development
- Development of new & innovative assembly concepts for electronic components
- Thermal and thermos-mechanical simulations of chip-package systems with ANSYS
- Definition of system interfaces for the FEM-Models
- Managing the software and hardware setup for Simulations
- Assessment of assembly technologies regarding suitability for automotive applications
- Assistance for important sample build at packaging subcontractors in East Asia (e.g. Malaysia, Korea, Philippines)


- Highly skilled in electronic assembly & interconnect technology (AIT) & packaging assembly processes
- Knowledge of FEM Simulations with ANSYS (thermal and thermo-mechanical)
- Excellent communication skills, English language (level C1, minimum B2)
- Innovative & highly self-motivated personality with strong result orientation
- Intercultural competence, open-minded
- Willingness to travel

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