Electronics & Semiconductor Should Cost

• Rapid should-cost assessment for semiconductors, MCU/ASIC, sensors, power electronics, PCB/PCBA, connectors and passive components.
• Build cost logic based on wafer process, die size, yield, packaging, testing, PCB technology and SMT assembly.
• Develop reusable calculation models and challenge supplier quotations with fact-based cost drivers.

Quotation & Sourcing Support

• Set competitive electronic BOM targets, including piece price, NRE/tooling and productivity assumptions.
• Support supplier negotiation, localization, second source and technology scenario evaluation.
• Track target achievement and drive cost-gap closure with R&D, Purchasing and Product Management.

Design to Value

• Participate early in concept and design phases and translate customer needs and market trends into target functions and allowable cost.
• Identify over-specification, unnecessary complexity and low-value features.
• Drive DtV, DtC and Re-DtC activities and evaluate architecture and performance-cost trade-offs.

Benchmark & Competence Building

• Lead electronics tear-down and competitor cost benchmarking.
• Build China/Asia electronics market intelligence, supplier knowledge and cost databases.
• Transfer China insights and best practices to Asia and selected global projects.

  Electronics & Semiconductor Should Cost

• Rapid should-cost assessment for semiconductors, MCU/ASIC, sensors, power electronics, PCB/PCBA, connectors and passive components.
• Build cost logic based on wafer process, die size, yield, packaging, testing, PCB technology and SMT assembly.
• Develop reusable calculation models and challenge supplier quotations with fact-based cost drivers.

• Quotation & Sourcing Support

• Set competitive electronic BOM targets, including piece price, NRE/tooling and productivity assumptions.
• Support supplier negotiation, localization, second source and technology scenario evaluation.
• Track target achievement and drive cost-gap closure with R&D, Purchasing and Product Management.

•  

  Design to Value

• Participate early in concept and design phases and translate customer needs and market trends into target functions and allowable cost.
• Identify over-specification, unnecessary complexity and low-value features.
• Drive DtV, DtC and Re-DtC activities and evaluate architecture and performance-cost trade-offs.

•  

  Benchmark & Competence Building

• Lead electronics tear-down and competitor cost benchmarking.
• Build China/Asia electronics market intelligence, supplier knowledge and cost databases.
• Transfer China insights and best practices to Asia and selected global projects.

• Bachelor’s or Master’s degree in Electronics, Microelectronics, Semiconductor Engineering or a related field.
• Minimum 5 years of experience in automotive electronics, semiconductor manufacturing, electronic component engineering, cost engineering, technical purchasing or value engineering.
• Strong knowledge of semiconductor manufacturing flow, packaging/testing, PCB/PCBA processes, electronics supply chain and should-cost methodology.
• Able to convert incomplete technical information into a fast, structured and defendable cost estimate with transparent assumptions.
• Strong commercial sense, analytical thinking and cross-functional communication skills; proficient in English.

FAST SHOULD COST
Quickly evaluates chipset and electronic component cost.

MARKET-BACK
Understands what customers and markets truly need.

FACT-BASED CHALLENGER
Challenges suppliers and specifications with cost transparency.

VALUE CREATOR
Moves beyond calculation to actively drive Design to Value.

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