Packaging Program Manager

  • Taoyuan District, Taoyuan City, Taiwan 330
  • Full-time

Company Description

Butterfly Network has created and brought to market the Butterfly IQ – the first FDA-cleared, portable device that puts ultrasound technology on a semiconductor chip. Pairing ultrasound-on-a-chip with the cloud and AI, we are doing something never done before, and bringing ultrasound to new domains around the world.

Since inception, Butterfly has raised over $375 million.

As we scale our team, we are seeking the best and the brightest engineers, across both the software and hardware worlds.

Job Description

  • Manage the NPI projects - define and execute the plan according to business needs,  work with cross functional teams to gather the needed process and design information,  and BOMs to enable package house to perform sensor builds
  • Follow phase-gate process to qualify new product/process, suppliers and components
  • Coordinate with cross functional teams to set the priority for meeting various project goals
  • Work with sourcing, marketing, foundry engineers and suppliers to fulfill the market demand
  • Covert the DOE plans initiated by engineering teams into executable production plan, including managing BOM and resource allocation
  • Provide timely communication to the stakeholders regarding WIP status, material shortages, potential schedule interruptions, and equipment issues that would affect production output  
  • Coordinate with cross functional teams to set the priority for meeting various project goals
  • Direct finished goods distribution internal and external customers

Location: This position will be based in Taoyuan City, Taiwan.  Employee will need to travel frequently to New Taipei and Hsinchu areas also.

Qualifications

  • Bachelor’s Degree in engineering, business management, or the equivalent of 5 years in manufacturing operations, including manufacturing systems, product costing and planning
  • 3+ years of managing packaging NPI projects or process integration experience of package development
  • 3+ years of planning experience in a semiconductor and OSAT manufacturing 
  • Must have ability to communicate effectively with colleagues and management team
  • Experience with MRP system  
  • Proven experience and track record in manufacturing planning
  • Proficient in MS Office or equivalent computer skills
  • Knowledge of shop floor control system, manufacturing principles and operations
  • Fluent in English and Mandarin

Additional Information

We offer great perks:

  • Fully funded medical insurance, dental, vision coverage
  • Competitive salary + equity in the company
  • Free on-site meals + unlimited healthy snacks
  • Pre-tax commuter benefits
  • The chance to help improve the healthcare and save millions of lives!

Butterfly Network is an equal opportunity employer regardless of race, color, ancestry, religion, gender, national origin, sexual orientation, age, citizenship, marital status, disability, or Veteran status.

Butterfly Network does not accept agency resumes.

All your information will be kept confidential according to EEO guidelines.