Package Engineer/Lead

  • Taoyuan District, Taoyuan City, Taiwan 330
  • Full-time

Company Description

Butterfly Network has created and brought to market the Butterfly IQ – the first FDA-cleared, portable device that puts ultrasound technology on a semiconductor chip. Pairing ultrasound-on-a-chip with the cloud and AI, we are doing something never done before, and bringing ultrasound to new domains around the world.

Since inception, Butterfly has raised over $375 million.

As we scale our team, we are seeking the best and the brightest engineers, across both the software and hardware worlds.

Job Description

  • Sustain production processes with foundry engineers, and transfer new processes to foundry sites from the development team to meet business needs
  • Work with foundry partners to build up production capacity to support production ramp
  • Identify high-risk processes, plan improvement and develop solutions to optimize and increase product yield
  • Analyze production data, write reports and make technical recommendations to drive continuous improvement
  • Support cross functional team to develop best-known method for new product introduction
  • Assist in documentation creation and establish in-process quality control metrics based on the assembly spec released by the process development team


Basic qualifications:

  • BS/MS degree in EE, ME, Chemistry, Material Science, or related field
  • 5-10 years experience of semiconductor package engineering or an equivalent combination of relevant technical training and experience.
  • Have hands-on experience or knowledge of the following areas: wafer thinning, dicing, wire bonding, chip molding, wafer bonding, die attach, thin film package, wafer level package, BGA, SMT and advanced package technologies
  • Experience in transferring processes from and to different manufacturing sites
  • Familiar with tools for manufacturing quality control
  • Ability to investigate, analyze and resolve technical issues related to processes and equipment in the production environment.
  • Must have the ability to communicate effectively with colleagues and management team
  • Fluent in English and Mandarin

    Desired expertise:
  • Experience with MEMS package
  • Experience with process integration
  •  Experience with organic materials
  • Familiarity with package and PCB design rules
  • Experience of working with foundry suppliers

Additional Information

This position will be based in Taoyuan City, Taiwan. The position will require to travel frequently to New
Taipei and Hsinchu areas